The Iwaki factory began operation in 2005 and it is here that we develop the production processes of LC photomask substrates as well as of parts for wafer heat-treatment equipment. We also utilize IT in our research and development on microchips for medical treatment and biotechnology products, as well as on micro parts for next generation semiconductors.
Large-scale wire slicer
In order to answer the needs of the increasingly large scale of liquid crystal photomasks, we have supplied our Iwaki factory with a stateof-the-art large-scale wire slicer that can cut 1,100 mm x 900 mm quartz ingots. As cutting thickness is possible to any size between 3.5 and 12 millimeters and cutting loss is reduced by one-third in comparison with conventional bandsaws, a high yield is thus achieved using this cutting process.
In order to enable the manufacture of various sizes of tubes, small, medium and large, the Iwaki factory is equipped with both 12- and 16-inch automatic molding lathes. With the 16-inch unit, tubes of up to 700 mm in diameter is possible and both lathes are equipped with sensors for measuring and managing numerical values for thickness and external diameter with high accuracy. Through such superior performance, product quality is assured.
Laser processing device
gas laser processing device has been introduced to enable work at dimensions of 1220 X 1220 X 16 t, a Z-axis height of 300 mm and rated output of 2 kW and respond to the needs of high-precision processes.
Grinding & Polishing
One vertical and one horizontal grinder, a cylinder grinder and a rotary flat grinder have been installed in order to handle versatile and diverse grinding work.
Utilizing proprietarily developed high-performance carbon tools, our skilled engineers make excellent use of our original processing technology in various welding procedures.